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Absolute Maximum Ratings (T A = 25°C unless otherwise specified)
Symbol
T OPR
T STG
Parameter
Operating Temperature
Storage Temperature
Rating
-40 to +100
-40 to +100
Unit
°C
°C
T SOL-I
Soldering Temperature
(Iron) (2,3,4)
240 for 5 sec
°C
T SOL-F
I F
V R
Soldering Temperature (Flow) (2,3)
Continuous Forward Current
Reverse Voltage
260 for 10 sec
50
5
°C
mA
V
P D
Power
Dissipation (1)
100
mW
Notes:
1. Derate power dissipation linearly 1.33mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6mm) minimum from housing.
Electrical/Optical Characteristics (T A = 25°C)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
λ P
Θ
V F
I R
I e
t r
t f
Peak Emission Wavelength
Emission Angle
Forward Voltage
Reverse Current
Radiant Intensity
Rise Time
Fall Time
I F = 100mA
I F = 100mA
I F = 100mA, t p = 20ms
V R = 5V
I F = 100mA, tp = 20ms
I F = 100mA
t p = 20ms
8
940
±12
1
1
1.6
100
nm
°
V
μA
mW/sr
μs
μs
?2002 Fairchild Semiconductor Corporation
QEB363 Rev. 1.0.0
2
www.fairchildsemi.com
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